Custom Heat Sink Solutions
context： From Skived Fins to Heat Pipe Assemblies. We provide end-to-end air cooling solutions—offering thermal simulation, prototyping, and mass production for high-performance electronics.
What is a Heat Sink?
What Is A Heat Sink? In high-performance electronics, efficient thermal management is the key to reliability and longevity. A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device.
At JINDU, we don’t just manufacture metal parts; we provide system-level cooling solutions. Whether it’s for telecommunications, automotive, or medical devices, our heat sinks are designed to maintain optimal operating temperatures, preventing overheating and ensuring your equipment performs at its peak.
Our Heat Sink Manufacturing Processes
At Jindu, we offer a comprehensive portfolio of thermal manufacturing technologies. From standard extrusions to high-performance composite assemblies, we utilize the specific process that best matches your thermal performance targets, spatial constraints, and budget.
Skiving fin process
We utilize advanced skiving technology to slice thin fins directly from a solid block of aluminum or copper. This process creates a heat sink with a high fin density and a one-piece structure.
- Key Advantage: Zero thermal interface resistance between the fins and the base, as they are formed from the same material. It allows for thinner fins and tighter spacing than extrusion.
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Best For: High-power density applications where airflow is limited and maximum surface area is required.
Extrusion Process
The most common and cost-effective method for manufacturing aluminum heat sinks. Hot aluminum is pushed through a die to create the desired profile.
- Key Advantage: Extremely low unit cost for mass production and structural strength. We offer a wide variety of standard profiles and custom die designs.
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Best For:General electronics, PCB board level cooling, and industrial enclosures.
Bonded Fin Process
This process involves bonding individual fins into grooves machined on a base plate using a high-conductivity thermal epoxy or brazing resin.
- Key Advantage: Breaks the size limitations of extrusion. We can manufacture heat sinks with extremely high aspect ratios (very tall fins) and large footprints without requiring massive tooling investments.
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Best For:Large-scale industrial inverters, traction converters, and power supply units.
Cold forging process
Cold forging involves pressing raw metal into a die under high pressure at room temperature to form the heat sink shape, typically with pin fins or elliptical fins
- Key Advantage: Produces a dense material structure with excellent thermal conductivity. The pin-fin design allows for omni-directional airflow, making it ideal for environments where airflow direction is unpredictable.
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Best For: LED lighting and chipsets cooled by natural convection.
CNC machined
We utilize high-precision CNC machining centers to mill complex geometries directly from aluminum or copper blocks. This process ensures the tightest tolerances and smoothest surface finishes for critical mounting interfaces.
- Key Advantage: Exceptional precision and design flexibility without the need for molds. It allows for the creation of complex features, flat surfaces, and prototypes that other processes cannot achieve.
- Best For:Low-volume production, rapid prototyping, and aerospace or medical applications requiring high precision.
Die Casting Heat Sinks
Molten metal (typically Aluminum or Zinc) is injected into a mold under high pressure. This is the go-to process for complex 3D shapes.
- Key Advantage:Ideal for high-volume production. It allows for the integration of mounting features, housings, and heat sinks into a single component, reducing assembly steps.
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Best For:Automotive housings, outdoor telecommunication enclosures, and consumer electronics.
Zipper Fin Heat Sinks
Zipper fins are stamped from sheet metal and folded into an interlocking geometry. These lightweight fin stacks are then typically soldered or bonded to a metal base to create a high-performance assembly.
- Key Advantage: Enables high fin density and thin profiles while maintaining a lightweight structure. It allows for hybrid designs (e.g., copper base with aluminum fins) to optimize both cooling performance and weight.
- Best For: Forced convection environments such as servers, data centers, and laptop cooling where space and weight are critical.
Customized Heat Sink
JINDU provides more than just manufacturing; we offer end-to-end thermal solutions.
Industry Applications
Serving Critical Industries Our thermal solutions are trusted in the most demanding sectors:
Telecommunications
5G Base stations and network equipment.
Automotive
EV battery cooling and power electronics (IATF 16949 Standard).
Medical Devices
Precision cooling for imaging and diagnostic equipment.
Power Electronics
Inverters, converters, and IGBT modules.
Aerospace
Lightweight and high-reliability thermal components.
Engineering Support
Design & R&D Support Not sure which heat sink is right for you? Our strong technical R&D team is here to help.
How We Design Your Heatsink?
From Concept to Optimization:Our Design Process At JINDU, we are not just a manufacturer; we are your thermal engineering partner. We utilize our rich machining experience to provide mechanical design suggestions that optimize performance and cost.
Step 1: Thermal Simulation & Analysis
Before cutting any metal, our R&D team performs advanced thermal simulation. We analyze airflow speed, pressure drop, and heat distribution to predict how the heatsink will perform in your specific environment.
Step 2: DFM (Design for Manufacturing)
We review your design to ensure it is feasible for mass production. Whether it's selecting the right fin density for Skiving or optimizing tool paths for CNC machining, we help you reduce waste and production time.
Step 3: Material & Process Selection
Based on your thermal targets (Watts) and budget, we recommend the best material (AL6063, Copper) and process (Extrusion, Skiving, or Soldering) to achieve the best thermal resistance.
How We Test Heatsink Performance?
Ensuring Reliability Through Rigorous Testing: Quality is in the details. JINDU is equipped with accurate inspection and testing equipment to ensure every heatsink meets your specifications.
We conduct real-world thermal testing to validate the simulation data, ensuring the heatsink effectively dissipates the required heat load.
Using high-precision CMM (Coordinate Measuring Machines), we verify that critical tolerances are within ±0.005mm, ensuring a perfect fit with your PCB or device.
We test the raw material composition to ensure high thermal conductivity and compliance with RoHS/Reach standards.
Why Choose Jindu?
How to Select The Right Heat Sink?
Calculate the power (Watts) your device generates.
Check the available volume (L x W x H) in your system.
Decide between Natural Convection, Forced Air (Fan), or Liquid Cooling based on power density.
Send us your requirements, and our engineers will recommend the best process (e.g., Skiving for high density, Liquid Plate for high power).
FAQ
Liquid cooling (Cold Plates) is recommended for high-wattage components (like IGBTs or EV batteries) where air cooling cannot maintain safe temperatures within the available space.
Skiving allows for thinner fins and higher density than extrusion, offering better thermal performance for the same volume.
Yes. We offer comprehensive thermal simulation and mechanical design suggestions to ensure your thermal solution is optimized for your specific application.